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In view of the heat dissipation problem of high-power LED packaging, people have optimized the thermal system of the device in terms of packaging structure and materials. The early successful package structure is the AlGalnN power flip chip structure. Since the LED chip is flip-chip connected to the silicon substrate through bumps, the heat does […]
Packaging is an important part of the entity that constitutes the LED device. Although the LED package and the package of semiconductor discrete devices such as transistors have the functions of protecting the chip from the external environment and improving the thermal conductivity of the device, the LED package has great special characteristics. The important […]
①Causes of heating of LED devicesLike traditional light sources, LEDs also generate heat when they work. Under the action of an external electric field, the electrons in the N-type semiconductor gain energy to overcome the potential barrier at the PN junction and recombine a large number of holes in the P-type semiconductor. After recombination, the […]
①Voltage current characteristics of LEDThe volt-ampere characteristics of LEDs are shown in Figure 1, which is roughly the same as that of ordinary semiconductor diodes. It can be approximated that the current I is proportional to the nth power of the voltage U. When the voltage U is small, the current I is mainly a […]
The optical design of the LED is based on the premise of the existing LED to improve the limitation of the light-emitting angle of the LED itself. LED optical design is divided into primary optical design and secondary optical design. The primary optical design starts with the shape design of the LED packaging material and […]
Like traditional light sources, the common optical parameters of LEDs include light measurement, radiance measurement, and color measurement. Among them, the most important and basic is the average luminous intensity and total luminous flux in the luminosity measurement. The following will introduce how to perform LED optical measurement. ①Measurement of average luminous intensityIn many LED […]
With the continuous development of material technology, the design and manufacturing technology of commercial lighting-level LEDs has made considerable progress. LED manufacturing mainly includes chips, phosphors, optics, packaging, and electrostatic protection. The production of semiconductor materials for GaN has been greatly improved from traditional methods, such as the use of laser lifting methods to remove […]
The appearance of white LED has opened a brand new door for semiconductor lighting. At present, more and more indoor and outdoor lighting projects have adopted white LEDs. In just a few years after its birth, the luminous efficiency and power of white LEDs have made great progress. White LEDs have become The main force. […]
Structural characteristics of LED light-emitting devicesThe basic structure of the traditional LED is shown in Figure 1. The LED chip is fixed on a conductive and thermally conductive metal bracket with two wires. The lead with the reflective cup (or reflective bowl) is the cathode, and the other lead is the anode. The periphery of […]
There are non-radiative recombination centers in semiconductor materials, also known as extinction centers, which make the non-radiative recombination process in many semiconductor materials a dominant process. Material background impurities, lattice defects, complexes of defects and impurities, etc. may all become non-radiative recombination centers. They are very harmful to luminescence. Many types of non-radiative recombination processes […]