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How to optimize the heat dissipation of high-power LED packages?

November 29, 2021
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| LED light source and its driving technology
How to optimize the heat dissipation of high-power LED packages?

In view of the heat dissipation problem of high-power LED packaging, people have optimized the thermal system of the device in terms of packaging structure and materials. The early successful package structure is the AlGalnN power flip chip structure. Since the LED chip is flip-chip connected to the silicon substrate through bumps, the heat does […]

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Posted in <a href="https://www.outdoorsolarpowerlighting.com/category/led-light-source-and-its-driving-technology/" rel="category tag">LED light source and its driving technology</a> Tagged <a href="https://www.outdoorsolarpowerlighting.com/tag/metal-circuit-board-structure/" rel="tag">Metal circuit board structure</a>, <a href="https://www.outdoorsolarpowerlighting.com/tag/micro-pump-structure/" rel="tag">Micro pump structure</a>, <a href="https://www.outdoorsolarpowerlighting.com/tag/packaging-materials/" rel="tag">Packaging materials</a>, <a href="https://www.outdoorsolarpowerlighting.com/tag/paste-material/" rel="tag">Paste material</a>, <a href="https://www.outdoorsolarpowerlighting.com/tag/substrate-material/" rel="tag">Substrate material</a>

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